IC Package Layout Engineer
Description
IC Package Layout Engineer in Mobileye's R&D division designs substrate layouts for EyeQ™ chips with emphasis on automotive applications. The role includes independent work on bump fan-out design, high-resolution routing, and compliance with SI/PI and DFM constraints in collaboration with silicon and manufacturing teams. At least 5 years of experience in IC package substrate design is required, proficiency in Cadence Allegro, and deep knowledge of high-speed layout principles and power delivery. Advantage for candidates with experience in RF, multi-die packages, or DDR/PCIe interfaces. Location: Jerusalem · Full-time · Department: R&D To apply: On the company website, via the button below
Details
Company
mobileye
Location
Jerusalem
IC Package Layout Engineer
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